doi: 10.7763/IJFCC.2015.V4.369
Identification of Faulty BGA Solder Joints in X-Ray Images
Mohammad S. Laghari
,
Qurban A. Memon
- Department of Electrical Engineering, United Arab Emirates University, P. O. Box: 15551, Al Ain, United Arab Emirates.
Abstract
The advantages of X-ray inspection are extensivein scope due to the ability of X-rays to see through packagesincluding heat sinks, welds, encapsulation, and metallic shielding to reveal obscured connections and identify potentialquality non-destructive issues. Many assembly linemanufacturers rely on real-time X-ray technology to evaluatesolder joint integrity for BGAs and other leadless packages thatcannot be inspected by conventional vision systems. X-rayinspection is particularly beneficial to applications that involve advanced surface-mount packaging technologies such as BallGrid Array (BGA) used for integrated circuits. This paper proposes a method that relies on computer vision and image processing techniques that inspects each ball image of a BGAchip and indicates the faulty balls for further assessment. Thedefective balls that are typically circular change into elongatedor elliptical shape. Therefore, it exploits the use of the basic geometric distinction between a circle (perfect soldered ball)and an ellipse or any other shape (ball with reshaped solder joint). A contour analysis method is defined in this paper interms of the angle changes that occur along the outline profile ofa solder joint by moving three equal distant points located onthe border. This angle change is plotted to detect the faulty balljoints.
Keywords
- BGA
- shape analysis
- solder joints
- X-raytechniques
How to Cite
Mohammad S. Laghari and Qurban A. Memon, "Identification of Faulty BGA Solder Joints in X-Ray Images," International Journal of Future Computer and Communication, vol. 4, no. 2, pp. 122-125, 2015. https://doi.org/ 10.7763/IJFCC.2015.V4.369
Copyright & License
Copyright © 2015 by the authors. This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).